Name: 10th International Meeting on Front-End Electronics (FEE 2016)
Start: 2016-05-30T08:45:00+02:00
End: 2016-06-03T14:00:00+02:00
Location: AGH University of Science and Technology

3D integration technology – status (in session "3D integration")

11th Front-End Electronics Workshop 2018 (in session "XFEL detectors")

100ps time resolution for silicon pixel detectors (in session "Timing")

ABCStar for ATLAS Strips (in session "LHC upgrades")

An asynchronous pixel front-end channel in 65 nm CMOS for the HL-LHC experiment upgrades (in session "Advanced pixels")

Chess2 front end readout of the multi-segmented HV CMOS sensors (in session "CMOS MAPS")

CHIPIX65 prototype matrix chip (in session "LHC upgrades")

CLICPix (in session "Advanced pixels")

CMS HGCAL (in session "FE for Calorimeters")

DC-DC converters In front-end systems (in session "LHC upgrades")

Development of SOI monolithic pixel sensors (in session "Advanced pixels")

Electronics in particle physics - personal experience (in session "Introduction")

Fast signal processing for multi-pixel SiPM imaging system (in session "Miscellaneous")

Fast timing techniques (in session "Timing")

FE65_P2: Prototype Pixel Readout Chip in 65nm for HL-LHC Upgrades (in session "Deep submicron")

FLAME, an ASIC for luminometer at a future linear collider (in session "FE for Calorimeters")

Front end electronics for silicon strip detectors in submicron technologies (in session "Deep submicron")

High dynamic range pixel readout in a Si-Ge process (in session "Advanced pixels")

Hybrid pixels of LHCb (in session "LHC upgrades")

Introduction (in session "Introduction")

LCLS and LCLSII (in session "Other photon detectors")

Low temperature CMOS electronics for LAr, LXe and Ge detectors and its role in future experiments (in session "FE for Calorimeters")

Low-power front-end for the readout of GEM detectors in the CMS Experiment (in session "FE for Gas Detectors")

Mega-Hertz imagers for the European XFEL (in session "XFEL detectors")

Monch detector (in session "Other photon detectors")

Monolithic CMOS sensors (in session "CMOS MAPS")

New developments for the liquid argon calorimeter (in session "Miscellaneous")

Noise measurements on 65 nm CMOS transistors at very high total doses (in session "Deep submicron")

PERCIVAL CMOS imager (in session "XFEL detectors")

Pinned Photodiode for Image Sensors (in session "Keynote")

Pixels for ALICE tracker upgrade (in session "LHC upgrades")

Progress on the LPD detector and new activities at RAL (in session "XFEL detectors")

PS chip development (in session "LHC upgrades")

RADEM, NIRCA and SIPHRA ASICs for space applications (in session "Space Applications")

Readout Channel with Dynamic Range Compression for Signal Processing in Applications at Future X-ray FEL (in session "Advanced pixels")

Registration (in session "Registration")

ROC chips for SiPM and fast timing (in session "Timing")

SALT ASIC for LHCb tracking (in session "LHC upgrades")

Single photon imagers (in session "Advanced pixels")

SiPM readout (in session "Miscellaneous")

SOPHIAS for the X-ray Free-Electron Laser Experiments (in session "Other photon detectors")

Spectroscopic imaging detectors for hard X-ray applications (in session "Miscellaneous")

The 3D digital SiPM for nEXO (in session "3D integration")

The readout ASIC for the DSSC camera for the European XFEL (in session "XFEL detectors")

Ultra fast photon counting chip (in session "Advanced pixels")

VIPIC-Large 3D pixel readout for XPCS (in session "3D integration")

VMM ASIC (in session "FE for Gas Detectors")

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10th International Meeting on Front-End Electronics (FEE 2016)