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10th International Meeting on Front-End Electronics (FEE 2016)

30 May 2016 to 3 June 2016
AGH University of Science and Technology
Europe/Warsaw timezone

Organizing Committee

Contribution List

48 out of 48 displayed
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  1. 49. Registration
    30/05/2016, 16:30
  2. 50. Registration
    31/05/2016, 08:30
  3. 46. Introduction
    31/05/2016, 09:00
  4. 51. Electronics in particle physics - personal experience
    Prof. Michal Turala (Polish Academy of Arts and Sciences (PL))
    31/05/2016, 09:15
  5. 12. Monolithic CMOS sensors
    Hans Krueger (University of Bonn)
    31/05/2016, 09:30
  6. 13. Chess2 front end readout of the multi-segmented HV CMOS sensors
    Herve Marie Xavier Grabas (University of California,Santa Cruz (US))
    31/05/2016, 09:55
  7. 14. Development of SOI monolithic pixel sensors
    Toshinobu Miyoshi (KEK)
    31/05/2016, 10:50
  8. 15. Single photon imagers
    Edoardo Charbon (TU Delft)
    31/05/2016, 11:15
  9. 16. Readout Channel with Dynamic Range Compression for Signal Processing in Applications at Future X-ray FEL
    Massimo Manghisoni (Università di Bergamo - Italy)
    31/05/2016, 11:40
  10. 17. High dynamic range pixel readout in a Si-Ge process
    Thomas Zimmerman (Fermi National Accelerator Lab. (US))
    31/05/2016, 12:05
  11. 18. Front end electronics for silicon strip detectors in submicron technologies
    Jan Kaplon (CERN)
    31/05/2016, 14:00
  12. 19. FE65_P2: Prototype Pixel Readout Chip in 65nm for HL-LHC Upgrades
    Tomasz Hemperek
    31/05/2016, 14:25
  13. 20. Noise measurements on 65 nm CMOS transistors at very high total doses
    Valerio Re
    31/05/2016, 14:50
  14. 21. SiPM readout
    Manuel Rolo
    31/05/2016, 15:45
  15. 22. Fast signal processing for multi-pixel SiPM imaging system
    Inge Diehl
    31/05/2016, 16:10
  16. 10. New developments for the liquid argon calorimeter
    Mitchell Franck Newcomer (University of Pennsylvania (US))
    31/05/2016, 16:35
  17. 47. Spectroscopic imaging detectors for hard X-ray applications
    Paul Seller (RAL)
    31/05/2016, 17:00
  18. 24. ABCStar for ATLAS Strips
    Francis Anghinolfi (CERN)
    01/06/2016, 09:00
  19. 25. SALT ASIC for LHCb tracking
    Krzysztof Piotr Swientek (AGH University of Science and Technology (PL))
    01/06/2016, 09:25
  20. 26. PS chip development
    Kostas Kloukinas (CERN)
    01/06/2016, 09:50
  21. 27. DC-DC converters In front-end systems
    Katja Klein (Rheinisch-Westfaelische Tech. Hoch. (DE))
    01/06/2016, 10:50
  22. 28. CHIPIX65 prototype matrix chip
    Lino Demaria (Universita e INFN Torino (IT))
    01/06/2016, 11:15
  23. 30. Pixels for ALICE tracker upgrade
    Thanushan Kugathasan (CERN)
    01/06/2016, 11:40
  24. 32. Hybrid pixels of LHCb
    Martin Van Beuzekom (Nikhef National institute for subatomic physics (NL))
    01/06/2016, 12:05
  25. 34. The 3D digital SiPM for nEXO
    Jean-Francois Pratte (Universite de Sherbrooke)
    01/06/2016, 14:00
  26. 36. 3D integration technology – status
    Grzegorz Deptuch (Fermi National Accelerator Lab. (US))
    01/06/2016, 14:25
  27. 38. VIPIC-Large 3D pixel readout for XPCS
    Farah Fahim (Fermi National Accelerator Lab. (US))
    01/06/2016, 14:50
  28. 48. Pinned Photodiode for Image Sensors
    Nobukazu Teranishi
    02/06/2016, 08:45
  29. 29. Low-power front-end for the readout of GEM detectors in the CMS Experiment
    Mieczyslaw Maria Dabrowski (KU Leuven (BE))
    02/06/2016, 09:30
  30. 31. VMM ASIC
    Gianluigi De Geronimo (Brookhaven National Laboratory (US))
    02/06/2016, 09:55
  31. 33. Progress on the LPD detector and new activities at RAL
    Marcus Julian French (STFC - Rutherford Appleton Lab. (GB))
    02/06/2016, 10:50
  32. 35. The readout ASIC for the DSSC camera for the European XFEL
    Florian Erdinger (University of Heidelberg)
    02/06/2016, 11:15
  33. 37. PERCIVAL CMOS imager
    Alessandro Marras (Deutsches Elektronen-Synchrotron)
    02/06/2016, 11:40
  34. 39. Mega-Hertz imagers for the European XFEL
    Ulrich Trunk
    02/06/2016, 12:05
  35. 52. 11th Front-End Electronics Workshop 2018
    Jean-Francois Pratte (Universite de Sherbrooke)
    02/06/2016, 12:30
  36. 40. LCLS and LCLSII
    Pietro Caragiulo (SLAC)
    02/06/2016, 14:00
  37. 41. Monch detector
    Roberto Dinapoli (Paul Scherrer Institut)
    02/06/2016, 14:25
  38. 42. SOPHIAS for the X-ray Free-Electron Laser Experiments
    Takaki Hatsui (RIKEN)
    02/06/2016, 14:50
  39. 43. CLICPix
    Pierpaolo Valerio (CERN)
    02/06/2016, 15:45
  40. 44. Ultra fast photon counting chip
    Pawel Grybos (AGH University of Science and Technology)
    02/06/2016, 16:10
  41. 45. An asynchronous pixel front-end channel in 65 nm CMOS for the HL-LHC experiment upgrades
    Lodovico Ratti (Universita e INFN, Pavia (IT))
    02/06/2016, 16:35
  42. 5. Fast timing techniques
    Angelo Rivetti (Universita e INFN Torino (IT))
    03/06/2016, 09:00
  43. 6. 100ps time resolution for silicon pixel detectors
    Lorenzo Paolozzi (Universite de Geneve (CH))
    03/06/2016, 09:25
  44. 7. ROC chips for SiPM and fast timing
    Christophe De La Taille (OMEGA (FR))
    03/06/2016, 09:50
  45. 23. RADEM, NIRCA and SIPHRA ASICs for space applications
    Dirk Meier (IDEAS and CERN), Dirk Meier (IDEAS)
    03/06/2016, 10:50
  46. 8. CMS HGCAL
    Damien Thienpont (IN2P3/OMEGA)
    03/06/2016, 11:15
  47. 9. Low temperature CMOS electronics for LAr, LXe and Ge detectors and its role in future experiments
    Shaorui Li
    03/06/2016, 11:40
  48. 11. FLAME, an ASIC for luminometer at a future linear collider
    Marek Idzik (AGH University of Science and Technology (PL))
    03/06/2016, 12:05

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