For the High-Luminosity upgrade of the LHC, a new pixel detector is foreseen for the ATLAS experiment. Currently, the prototyping phase is ongoing to build various detector components. The standard hybrid pixel modules consisting of a silicon pixel sensor and front-end electronics connected via bump-bonging are widely used. Prototypes with p-type sensors are built and tested. In a second step the modules are assembled and tested on larger structures so-called staves. This includes various new challenges. In the talk the challenges, the prototyping status and plans for a larger structure are presented.
In addition, as an alternative module assembly step, the concept deploying through-silicon-vias and laser soldering will be shown. Using modified components of standard modules first trials of TSV modules are discussed.