Speaker
Anton Saressalo
(Helsinki Institute of Physics (FI))
Description
One of the major topics in the vacuum arcing community during the recent years has been the balance between the bulk and surface effects on the breakdown generation.
In our recent study, argon and oxygen plasma were used to clean the surfaces of copper electrodes prior exposing them to high-voltace DC pulses and breakdowns. This was done without the need to open the vacuum and expose the electrodes to air in between the cleaning and pulsing.
The plasma cleaning is shown to reduce the number of surface impurities and to speed up the conditioning process of the Cu samples. Especially the achieved electric field until the first breakdown was observed to increase by nearly 100 %.
Authors
Anton Saressalo
(Helsinki Institute of Physics (FI))
Aarre Kilpeläinen
(University of Helsinki)
Flyura Djurabekova
(University of Helsinki)
