9–13 Jul 2023
Hawaii Convention Center
US/Hawaii timezone

Submission Categories

CALL FOR SPECIAL & JOINT SESSIONS

The CEC and ICMC Organizers invite the community to propose Special and/or Joint Sessions within the general scope of the Conference. To submit your special and/or joint session proposal, please email the appropriate Program Chairs listed here prior to the abstract submission deadline to include the session title and abstract along with the motivation of the special and/or joint session.

  • CEC Submission Categories

    • CEC-01 – Large-Scale: Refrigeration and Liquefaction

    • CEC-02 – Large-Scale: Systems, Facilities and Testing

    • CEC-03 – Cryocoolers: Non-Aerospace

    • CEC-04 – Cryocoolers: Aerospace

    • CEC-05 – Components: Expanders, Pumps, Compressors, Heat Exchangers, etc.

    • CEC-06 – Applications: Superconducting Systems

    • CEC-07 – Applications: Instrumentation, Visualization, and Controls

    • CEC-08 – Applications: Cryo-fuels Testing and Logistics

    • CEC-09 – Applications: Aerospace

    • CEC-10 – Applications: Quantum Systems and Materials

    • CEC-11 – Applications: Medicine and Biology

    • CEC-12 – Fundamentals: Thermal Properties and Theory/Numerical Studies

    • CEC-13 – Miscellaneous

    • CEC-14 – Special Sessions (select only if requested by a committee member to submit your abstract)

  • ICMC Submission Categories

    • ICMC-01 – NbTi/Nb3Sn/A15

    • ICMC-02 – MgB2 Wires and Tapes

    • ICMC-03 – BSCCO Wires and Tapes

    • ICMC-04 – REBCO Coated Conductors

    • ICMC-05 – Flux Pinning and Critical Current

    • ICMC-06 – LTS and HTS Cables

    • ICMC-07 – HTS and MgB2 Bulks

    • ICMC-08 – Fe-based and New Superconducting Materials

    • ICMC-09 – Modelling and AC Losses

    • ICMC-10 – Aging/Fatigue of LTS & HTS (e.g., Rotating Machines, Pulsed Magnets, …)

    • ICMC-11 – Thin Films, Multilayers, and Artificial Structures

    • ICMC-12 – Cryogenic Materials Testing and Methods

    • ICMC-13 – Metallic, Ceramic, Composite and Polymeric Materials

    • ICMC-14 – Insulation/Conduction, Resins and Impregnation, and Dielectric Properties

    • ICMC-15 – Thermal, Electrical, and Magnetic Properties, Radiation, Degradation

    • ICMC-16 – 3D Printed Materials

    • ICMC-17 – Superconductor Measurements: Mechanical, Electrical, AC Loss and Stability

    • ICMC-18 – Topological Materials for Electronics

    • ICMC-19 – Applications: Microelectronics, Photonics, Sensors, Detectors, Computation (Quantum, neuromorphic, others)

    • ICMC-20 – Applications: Power Electronics, Electric Propulsion, Transportation

    • ICMC-21 – Applications: Fusion and Accelerator Magnet Technologies

    • ICMC-22 – Applications: Superconductors in Space

    • ICMC-23 – Hydrogen Technologies and Compatible Materials

    • ICMC-24 – Sustainability / Life Cycle Analysis

    • ICMC-25 – Low Temperature Materials Database (select only if requested by a committee member to submit your abstract)

    • ICMC-26 – Special Sessions (select only if requested by a committee member to submit your abstract)