-aitor presentation:
pressure lost in he length of the foam. slide 4
for the test, we should be ready by 1-2 September, to start mount the test set up, and to put together the EM3. we do first wiring with antoine for the heater after the bending... gael checked with antoine the routing and soldering of the cables. the heaters is placed on the outside of the mandrel.welding pad for antoine are on the other side of the chip.
temperature sensors: idea is to go with the same sensor used ofr EM2, we need someone to solder the wires. we have to ask to antoine.Rene used always 0.1mm wire.wire should be thin
we can suck air also from the C side, but in principle we suck from c side towards the A side.
-presentation Gael
plexiglas to cover the set up, CYSS with modified radius to have the same gap for all the layers.
lee started to modify the mandrel, minor modifications, added pin holes
pictures of the parts made by accura extreme, as the accura 25 was in maitenance
chck if the holes are free.
the 2 tubes in the middle are for layer 0 and bp.we are at 1.5mm from the BP.final design pf layer 0 is different, for the other layers is close.
3d model ofr ITS3 win tunnel.discussed with antoine, stp behind the different fpc, 14.5 mm distance with air duct to put some electronics
for the heaters: we have a full set and a second set where we are missing one, with RUI. reply to them to produce additional spares.
aitor can already start to assemble. we have 1 set of 3D parts. once peter is back we give to him. we should use the original fan, but first we need to put the foam.if don't put the foam but something else,
Rene presentation
target to come here at cern to finalize some aspects together with Peter.
main concern: wire bonding. we should be sure that we find a way to sue this concept. no big alternatives. the other point is that we gain in assembly and deasssembly capability, but overall we will then to add end wheel or structure t align those fragile layer...and experience of its 2 is not trivial... the approach of simplify the assembly, to put a layer one after the other , don't take risk for the alignment.it has his limit, that at the end if one layer doesn't work we have to two half layer.
for the material budget, there a re 2 central rings, need to assessed the amount of glue with this options or wit the carbon foam option
for the cooling: the idea is to concentrate up to the carbon foam ring and the to manage the pressure drop trough this design.
suggest to look into the integration of one layer in respect to the other, the mechanics that we need. how the layout is further complicated by the interfaces.
torsional load between A and C side in the matching between layers
ITS3 -WP5
