TWEPP-07 Topical Workshop on Electronics for Particle Physics

Session

Plenary session P3

P3

5 Sept 2007, 09:00

Prague

108. Electronics and Sensor Study with the OKI SOI process

Yasuo Arai (High Energy Accelerator Research Organization (KEK))

05/09/2007, 09:00

Oral

We are evaluating SOI (Silicon-On-Insulator) technology for radiation-hard electronics and monolithic radiation sensor applications. The process we used is a 0.15um CMOS, fully-depleted SOI technology developed by OKI Electronics Industry Co. Ltd. This SOI device has two Si layers; one is a thick substrate (handle wafer) which is Czochralski high-resistivity silicon, and another is SOI layer...

109. 3D System Integration for high density interconnects

Mr Robert Wieland

05/09/2007, 09:45

Oral

3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also offers the possibility to build up systems with high complexity by combining devices of different technologies. Ultra thin silicon is the base of this...