Speaker
Description
The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for an upgrade of the CMS tracker detector to cope with the increased radiation fluence, 2.3E16 neq/cm2 (1MeV equivalent neutrons) for the innermost layer while maintaining the excellent performance of the existing detector. An extensive R&D program aiming at 3D and thin planar pixel sensors, has been put in place by CMS. The new CMS pixel detector is built with sensor modules covering 2 or 4 (2x2) readout chips. In planar pixel modules, the inter-chip sensor region is made by special pixel cells having a non-standard, typically bigger, cell size in order to bridge the gap between the CMS Read Out Chip (CROC), avoiding dead regions. A non irradiated CMS quad CROC module, made in silicon planar technology by Hamamatsu, was tested with a particle beam and results on the performance of the inter-chip pixel cells are presented in this talk. Another topic presented in this talk is a first measurement of the spatial resolution as a function of the tilt angle for 3D pixel sensors , made by the FBK foundry in Trento, Italy, in collaboration with INFN, equipped with the CROC after irradiation up to an equivalent fluence of 1E16 neq/cm2.
