2–7 Sept 2012
Hotel Listel Inawashiro, Inawashiro, Japan
Japan timezone

Towards third generation pixel readout chips

5 Sept 2012, 08:30
30m
Hotel Listel Inawashiro, Inawashiro, Japan

Hotel Listel Inawashiro, Inawashiro, Japan

Kawageta, Inawashiro, Fukushima 969-2696
ORAL Front end electronics and readout - Readout chip developments Session5

Speaker

Maurice Garcia-Sciveres (Lawrence Berkeley National Lab. (US))

Description

We present concepts and prototyping results towards a third generation pixel readout chip. We consider the 130nm feature size FE-I4 chip, in production for the ATLAS IBL upgrade, to be a second generation chip. A third generation chip would have to go significantly further. A possible direction is to make the IC so generic that different experiments can configure it to meet significantly different requirements, without the need for everybody to develop their own ASIC. In terms of target technology, a demonstrator 500-pixel matrix containing analog front ends only (no complex functionality), was designed and fabricated in 65nm CMOS and irradiated with protons in Dec. 2011 and May 2012. We present the design and measurement results.

Primary author

Maurice Garcia-Sciveres (Lawrence Berkeley National Lab. (US))

Co-authors

Presentation materials