Speaker
Description
The ALICE collaboration is currently developing a new vertex detector ("ITS3"), foreseen to be installed in 2026 - 2028 during LHC long shutdown 3 to replace the three innermost layers (Inner Barrel) of the current Inner Tracking System as from Run 4 onwards. ITS3 comprises the use of ultra-thin (down to 50 micrometers) silicon wafers and stitching technologies in 65nm CMOS imaging process to produce large area (9.8cm x 26.7cm) Monolithic Active Pixels Sensors with a very low power consumption and a very low material budget, which will be bent to half-cylindrical shapes of 19, 25.2 and 31.5 mm bending radii for layer 0, 1 and 2 respectively.
Within the comprehensive R&D program for the ITS3 different large area stitched prototype structures with various pixel pitch and matrix sizes have been produced and tested before and after irradiation with TID and NIEL to validate the ITS3 technology approach, resulting in detection efficiencies of >99% and fake hit rates of <1e-2/pixel/s. In this contribution we present an overview on detection performance measurements obtained for such prototypes in test beams using various chip settings.
| Primary experiment | ALICE |
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