Conveners
Front-end Electronics: Session 11
- Roelof de Vries
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Dr Jonathan Correa10/07/2025, 09:00invited talk
TEMPUS is a novel two-dimensional, event-driven X-ray detector developed to meet the growing demand for high temporal resolution in time-resolved synchrotron and FEL experiments. Based on the Timepix4 ASIC, TEMPUS enables continuous acquisition of individual photon events with nanosecond timestamping, offering a significant advancement over traditional frame-based systems. TEMPUS now serves as...
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Riccardo Bolzonella (CERN)10/07/2025, 09:30talk
The Medipix4 ASIC is the latest hybrid pixel detector in the Medipix family, developed using commercial 130nm CMOS technology for high-rate spectroscopic X-ray imaging. Like Timepix4, the Medipix4 chip features a four-side buttable design, enabling seamless large-area tiling via Through-Silicon Vias (TSV). Alternatively, the chip can be interfaced via top and bottom peripheral wirebonding,...
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Dr Petr Burian (Czech Technical University in Prague (CZ))10/07/2025, 09:50talk
The Timepix4 [1] readout chip introduces significant improvements over its predecessor, Timepix3 [2], in multiple aspects. One of the key advantages is the 3.5× larger active area, which allows for the coverage of a wider surface. Another major improvement is support for Through-Silicon Vias (TSV) technology. This feature enables the construction of large-area detectors with minimal dead zones...
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Davide Braga (FERMILAB)10/07/2025, 10:10talk
The 3DIntSenS Collaboration—a joint effort between SLAC, Fermilab, and LLNL—is developing enabling technologies for next-generation radiation imaging detectors that combine ultra-fine spatial resolution (~10 μm) with precision timing (<20 ps), while maintaining low power <1W/cm2 and high data throughput. The approach leverages 3D integration between advanced CMOS readout ASICs and finely...
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