18–22 May 2025
Peppermill Reno
US/Pacific timezone

Session

M1Po3D - Insulation, Impregnation, and Polymeric Materials

19 May 2025, 14:00
Exhibit Hall/Poster Area

Exhibit Hall/Poster Area

Conveners

M1Po3D - Insulation, Impregnation, and Polymeric Materials

  • Vincent Schenk (CERN)
  • Jonathan Demko (LeTourneau University)

Presentation materials

There are no materials yet.

  1. Shen Zhao (Technical Institute of Physics and Chemistry, Chinese Academy of Sciences)
    19/05/2025, 14:00
    Poster

    Polyimide (PI) aerogels have the advantages of low density, low thermal conductivity, excellent thermal stability and a wider range of working temperature than other organic aerogels, making them promising materials for cryogenic thermal insulation. The use of aerogel materials to replace the traditional porous perlite materials can further reduce the insulation cost, weight and space. Up to...

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  2. Hongwei Zhang (State Key Laboratory of Cryogenic Science and Technology, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences)
    19/05/2025, 14:00
    Poster

    Polymers play a crucial role as packaging materials for flexible electronic devices. Along with the rising power of electronic components, enhancing the thermal conductivity of hydrogel materials can greatly improve the performance of flexible electronic components. Herein, we designed a hydrogel material composed of polyvinyl alcohol (PVA) doped with 500nm boron nitride nanosheets (BNNS),...

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  3. Shanaka Kristombu Baduge (The University of Melbourne)
    19/05/2025, 14:00
    Poster

    Thermoplastics have long been a focal point in materials science, particularly in applications such as liquid hydrogen infrastructure and space fuel tanks. Their lightweight make them highly advantageous in such advanced technologies. However, the exploration of novel polymers for cryogenic applications has remained restricted to a limited subset of materials due to the high costs associated...

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