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TWEPP 2025 Topical Workshop on Electronics for Particle Physics

6–10 Oct 2025
Rethymno, Crete, Greece
Europe/Athens timezone

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Session

Integration, Interconnect and Packaging

7 Oct 2025, 17:40
Rethymno, Crete, Greece

Rethymno, Crete, Greece

Aquila Rithimna Beach Crete, Greece

Conveners

Integration, Interconnect and Packaging

  • Ioannis Kopsalis (National Technical Univ. of Athens (GR))
  • Ioannis Kopsalis (University of Birmingham (GB))
  • Francois Vasey (CERN)

Presentation materials

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  1. 130. Electro-mechanical integration of the ALICE ITS3 power and data distribution.
    Mr Antoine Junique (CERN)
    07/10/2025, 17:40
    Packaging and Interconnects
    Oral

    During LHC Long Shutdown 3, ALICE will replace its innermost three tracking layers with wafer scale stitched Monolithic Active Pixel Sensors(MAPS) bent around the beam pipe. Each 27 cm-long sensor is connected via wire bonds to a custom three-layer Flexible Printed Circuit(FPC). These FPCs deliver power, transmit up to 40 high-speed(10 Gb/s) data and control signals. Designed for a...

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  2. 162. Development of in-house plating and hybridisation technologies for pixel detectors
    Dr Ahmet Lale
    07/10/2025, 18:00
    Packaging and Interconnects
    Oral

    Reliable, cost-effective and scalable interconnect technologies are crucial for hybrid pixel detectors. Within the CERN EP-R&D programme and the AIDAinnova collaboration, a portfolio of single-die post-processing and hybridization techniques has been developed, especially suitable for small-volume productions. These include conductive adhesives (ACF and ACA) combined with in-house Ni/Au...

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