13–17 Apr 2026
Europe/Zurich timezone

Performance Characterisation of LF-MightyPix

17 Apr 2026, 12:30
20m
Talk Sensors

Speaker

Celina Welschoff (Heidelberg University (DE))

Description

For Run 5 of the LHC, LHCb foresees operating at an instantaneous luminosity of up to $1.0 \cdot 10^{34} \, \text{cm}^{-2} \,\text{s}^{-1}$. To cope with this challenging environment, the current detector needs to be upgraded. One crucial part of the upgrade is the new main tracker, the Mighty-Tracker. The innermost region will be instrumented with silicon pixel sensors, planned to be based on the High-Voltage Monolithic Active Pixel Sensor (HV-MAPS) technology. The sensors are required to achieve a hit detection efficiency larger than $ 99 \, \%$ within the $25 \, \text{ns}$ bunch-crossing period of the LHC, ensuring a unique bunch-crossing identification.

LF-MightyPix is the first prototype sensor for the Mighty-Tracker using the LFoundry $150 \, \text{nm}$ HV-CMOS process. Evaluating the performance of LF-MightyPix allows to qualify this process as a possible technology for the Mighty-Tracker pixel sensor. LF-MightyPix is a small-scale prototype, with a size of $3.5\, \text{mm} \times 4\ \text{mm}$ and a pixel pitch of $100 \, \text{µm} \times 100 \, \text{µm} $. In order to characterise the sensor's performance, a test beam campaign at the DESY II test beam facility has been performed. To operate the sensor in a beam telescope, EUDAQ2 has been implemented into the GECCO DAQ system. In this presentation the key features of LF-MightyPix are outlined and its test beam performance is presented. The results demonstrate a hit detection efficiency larger than $ 99 \, \%$ within $25 \, \text{ns}$, fulfilling the Mighty-Tracker requirements.

Author

Celina Welschoff (Heidelberg University (DE))

Co-authors

Mr David Philipp Kuhn (Heidelberg University (DE)) Ivan Peric (KIT - Karlsruhe Institute of Technology (DE)) Lucas Marvin Dittmann (Heidelberg University (DE)) Nicolas Striebig (KIT - Karlsruhe Institute of Technology (DE)) Richard Leys (KIT - Karlsruhe Institute of Technology (DE)) Ruben Kolb (Heidelberg University (DE)) Sebastian Bachmann (Heidelberg University (DE)) Toko Hirono (KIT - Karlsruhe Institute of Technology (DE)) Ulrich Uwer (Heidelberg University (DE))

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