September 30, 2012 to October 5, 2012
Stony Brook University
America/New_York timezone

BGA packaging of APV-25 Chip

Oct 2, 2012, 11:30 AM
15m
Wang Lecture Hall 2 (Stony Brook University)

Wang Lecture Hall 2

Stony Brook University

Speaker

Ben Buck (MIT)

Description

We have developed an easy to prototype BGA package for the APV-25S charge sensitive pre-amp ASIC. The APV chip, developed for the CMS tracker, is often used to readout GEM as well as silicon strip detectors. To reduce prototyping and development costs we have packaged the APV chips into a BGA. This allows front-end electronics to be developed and tested without the need to design boards with the very fine pitch wire bonding. It also allows boards with failed chips to be repaired easily. We will discuss the design, and production experience, and recommendations for future users.

Presentation materials