Speaker
Dr
Ronald Lipton
(Fermi National Accelerator Lab. (US))
Description
We report on the processing and performance of 3D integrated circuits (3DIC) bonded to silicon sensors. The circuits were part of the Fermilab-sponsored two-tier 0.13 micron run at Tezzaron/ Global Foundries. They include designs for the CMS track trigger, ILC vertex detectors, and x-ray correlation spectroscopy. Sensors were bonded to the 3DICs using
die-to-die solder ball bonding as well as with a chip-to-wafer oxide bonding process (Ziptronix DBI) similar to the wafer-to-wafer bonding process used for the 3DICs.
Primary author
Dr
Ronald Lipton
(Fermi National Accelerator Lab. (US))
Co-authors
Dr
Grzegorz Deptuch
(Fermi National Accelerator Lab. (US))
Jim Hoff
(Fermilab)
Julia Thom
(Cornell University (US))
Prof.
Mani Tripathi
(University of California Davis (US))
Marcel Trimpl
(Fermilab)
Meenakshi Narain
(Brown University (US))
Pawel Grybos
(High Energy Department)
Peter Siddons
(Brookhaven National Laboratory)
Peter Wittich
(Cornell University (US))
Mr
Ray Yarema
(FNAL)
Robert Szczygiel
(AGH UST)
Ulrich Heintz
(Brown University (US))
Zhenyu Ye
(Fermi National Accelerator Lab. (US))
