Performance of Three Dimensional Integrated Circuits Bonded to Sensors

4 Jun 2014, 16:40
20m
Administratiezaal (Beurs van Berlage)

Administratiezaal

Beurs van Berlage

Oral Emerging technologies: 4c) 3D integration IV.abc Cooling & MEMS & 3D

Speaker

Dr Ronald Lipton (Fermi National Accelerator Lab. (US))

Description

We report on the processing and performance of 3D integrated circuits (3DIC) bonded to silicon sensors. The circuits were part of the Fermilab-sponsored two-tier 0.13 micron run at Tezzaron/ Global Foundries. They include designs for the CMS track trigger, ILC vertex detectors, and x-ray correlation spectroscopy. Sensors were bonded to the 3DICs using die-to-die solder ball bonding as well as with a chip-to-wafer oxide bonding process (Ziptronix DBI) similar to the wafer-to-wafer bonding process used for the 3DICs.

Primary author

Dr Ronald Lipton (Fermi National Accelerator Lab. (US))

Co-authors

Dr Grzegorz Deptuch (Fermi National Accelerator Lab. (US)) Jim Hoff (Fermilab) Julia Thom (Cornell University (US)) Prof. Mani Tripathi (University of California Davis (US)) Marcel Trimpl (Fermilab) Meenakshi Narain (Brown University (US)) Pawel Grybos (High Energy Department) Peter Siddons (Brookhaven National Laboratory) Peter Wittich (Cornell University (US)) Mr Ray Yarema (FNAL) Robert Szczygiel (AGH UST) Ulrich Heintz (Brown University (US)) Zhenyu Ye (Fermi National Accelerator Lab. (US))

Presentation Materials