Speaker
Dr
Cinzia Da Via
(University of Manchester (GB))
Description
3D silicon sensors have completed the key milestones set by the 3DATLAS R&D collaboration and are now industrially fabricated. A new challenge is now being faced for the HL-LHC which will require a totally new approach in sensor fabrication. 3DS is an innovative fast, low mass modular system where all components, including cooling and active edges, are fabricated and are vertically integrated using microfabrication techniques. The talk will present some of the highlights of the current 3D sensors production and discuss the developement status of 3DS.
Authors
Ching Hung Lai
(The University of Manchester, UK)
Dr
Cinzia Da Via
(University of Manchester (GB))
Prof.
Gian-Franco Dalla Betta
(INFN and University of Trento)
Marco Povoli
(University of Trento (Italy))
Co-authors
Alessandro Mapelli
(CERN)
Chris Kenney
(SLAC)
Giulia Romagnoli
(Universita e INFN (IT))
Giulio Pellegrini
(Universidad de Valencia (ES))
Maurizio Boscardin
(FBK Trento)
Paolo Petagna
(CERN)
Philippe Jean-Paul Grenier
(SLAC National Accelerator Laboratory (US))
Sebastian Grinstein
(IFAE/ICREA - Barcelona)
Sherwood Ira Parker
(University of Hawai'i at Manoa (US))
