Speaker
Chris Parkes
(University of Glasgow)
Description
Detectors with a “double sided” 3D configuration have been fabricated at CNM, where the n- and p-type columns are etched from opposite sides of the wafer and do not pass through the full substrate thickness.
Strip detectors have been wire bonded to Beetle analogue front-end read-out chips. Pixel detectors have been bump-bonded to Medipix read-out chips at VTT. The initial results obtained from testing these devices in Glasgow are presented.
Authors
Dr
Celeste Fleta
(University of Glasgow)
Chris Parkes
(University of Glasgow)
Mr
David Pennicard
(University of Glasgow)
Dr
Guilio Pelligrini
(CNM)
Dr
Manuel Lozano
(CNM)
Dr
Richard Bates
(University of Glasgow)
Co-authors
Dr
Lars Eklund
(University of Glasgow)
Dr
Tomasz Szumlak
(University of Glasgow)
