Tilman Rohe
(Nuclear and Particle Physics Department)
04/06/2008, 09:00
3D Detectors and New Structures
The hybrid pixel detectors used in the LHC experiments use a vertical interconnection technique, the so-called bump bonding. As the pitch below 100 µm, required in these applications, cannot be fullfilled with standard industrial processes (e.g. the IBM C4 process), an in-house bump bond process with reflowed indium bumps was developed at PSI as part of the R&D for the CMS-pixel detector. Its...
Giulio Pellegrini
(Centro Nacional de Microelectronica CNM-IMB-CSIC)
04/06/2008, 09:20
I will report on the last results of double side 3D detectors fabrication and measurements with mip particles.
Chris Parkes
(University of Glasgow)
04/06/2008, 09:40
3D Detectors and New Structures
Detectors with a “double sided” 3D configuration have been fabricated at CNM, where the n- and p-type columns are etched from opposite sides of the wafer and do not pass through the full substrate thickness.
Strip detectors have been wire bonded to Beetle analogue front-end read-out chips. Pixel detectors have been bump-bonded to Medipix read-out chips at VTT. The initial results obtained...
Ulrich Parzefall
(Fakultaet fuer Physik)
04/06/2008, 10:30
We will report on the status of the test performed with 3D strip detectors that were fabricated at FBK-irst. Modules made by joining 3D detectors of several designs and ATLAS SCT read-out electronics exist, and were tested both before and after irradiation. Results from the 2007 3D test beam at CERN will also be shown.
