12th RD50 Workshop

Session

3D detectors & New structures

4 Jun 2008, 09:00

Ljubljana, Slovenia

31. Developement of an Indium Bump Bonding Process for Silicon Pixel Detectors at PSI

Tilman Rohe (Nuclear and Particle Physics Department)

04/06/2008, 09:00

3D Detectors and New Structures

The hybrid pixel detectors used in the LHC experiments use a vertical interconnection technique, the so-called bump bonding. As the pitch below 100 µm, required in these applications, cannot be fullfilled with standard industrial processes (e.g. the IBM C4 process), an in-house bump bond process with reflowed indium bumps was developed at PSI as part of the R&D for the CMS-pixel detector. Its...

15. Last results on 3D detectors fabrication and measurments

Giulio Pellegrini (Centro Nacional de Microelectronica CNM-IMB-CSIC)

04/06/2008, 09:20

I will report on the last results of double side 3D detectors fabrication and measurements with mip particles.

20. 3D Detector Testing

Chris Parkes (University of Glasgow)

04/06/2008, 09:40

3D Detectors and New Structures

Detectors with a “double sided” 3D configuration have been fabricated at CNM, where the n- and p-type columns are etched from opposite sides of the wafer and do not pass through the full substrate thickness. Strip detectors have been wire bonded to Beetle analogue front-end read-out chips. Pixel detectors have been bump-bonded to Medipix read-out chips at VTT. The initial results obtained...

10. Status of 3D Detector R&D in Freiburg

Ulrich Parzefall (Fakultaet fuer Physik)

04/06/2008, 10:30

We will report on the status of the test performed with 3D strip detectors that were fabricated at FBK-irst. Modules made by joining 3D detectors of several designs and ATLAS SCT read-out electronics exist, and were tested both before and after irradiation. Results from the 2007 3D test beam at CERN will also be shown.

29. Discussion on 3D detectors & New Structures

Chris Parkes (Glasgow)

04/06/2008, 10:50