Speaker
Julia Thom
(Cornell University)
Description
Three dimensional integrated circuit technologies offer the
possibility of fabricating large area arrays of sensors integrated
with complex electronics with minimal dead area, which makes them
ideally suited for applications at the LHC upgraded detectors and
other future detectors. We describe the ongoing R&D efforts to
demonstrate functionality of components of such detectors. This
includes testing of TSV technology, fabrication and testing of silicon
or glass interposer structures to assemble arrays that integrate and
match the pitch of large area sensors with arrays of readout
integrated circuits, as well as the study of integrated 3D electronics
with active edge sensors to produce "active tiles" which can be tested
and assembled in to arrays of arbitrary size with high yield. The
latter includes studies of possible post-processing to achieve active
edges without the complexity of silicon-on-insulator sensor
assemblies.
Primary authors
Chris Kenney
(SLAC)
Dr
Grzegorz Deptuch
(Fermi National Accelerator Lab. (US))
Julia Thom
(Cornell University)
Leonard Spiegel
(FNAL)
Prof.
Mani Tripathi
(UC Davis)
Marvin Johnson
(FNAL)
Meenakshi Narain
(Brown University (US))
Peter Siddons
(BNL)
Dr
Ronald Lipton
(Fermi National Accelerator Lab. (US))
Sherwood Ira Parker
(University of Hawai'i at Manoa (US))
Ulrich Heintz
(Brown University (US))
Zhenyu Ye
(Fermi National Accelerator Lab)
