15–17 Sept 2014
University of Bonn
Europe/Zurich timezone

Advances in Bonding technologies (chip to wafer and wafer to wafer)

16 Sept 2014, 17:15
30m
Bethe Forum (University of Bonn)

Bethe Forum

University of Bonn

Physikalisches Institut Nussallee 12 D-53115 Bonn

Speaker

Mr Ray Yarema (FNAL)

Presentation materials