Speaker
Singharach JANYOD
(Department of Industrial Physics and Medical Instrumentation, Faculty of Science, King Mongkut's University of Technology North Bangkok, THAILAND 10800)
Description
This research interested in studying about property of expired epoxy for extending life time of the epoxy in die attach process. Die attach process is one that is very important in the integrated circuit (IC) packaging manufacturing. A normal material used for attaching between die and substrate of a package which is an epoxy. From normal manufacturing process, an epoxy is stored in the frozen at - 40 °C and left at room temperature at 25 °C for 2 hours. The lifetime of epoxy is 24 hours, after that the large quantities of epoxy tubes shall be discarded. For experiment, the two types of expired conductive epoxy is used for die attach process of IC packages by changing the life time from 0, 6, 12, 18, 24, 30, 36, 42, and 48 hours. For analysis, these packages was tested by viscosity test, die shear test, and moisture sensitivity level test and was observed by scanning electron microscopy (SEM) to analyze properties of epoxy with a life time. The results revealed that possibility to extend the lifetime of epoxy from 24 hours to 30 hours.
Primary author
Singharach JANYOD
(Department of Industrial Physics and Medical Instrumentation, Faculty of Science, King Mongkut's University of Technology North Bangkok, THAILAND 10800)
Co-authors
Mr
Chalermsak SUMITHPIBUL
(Engineering Department, UTAC Thai Limited, Bangkok, THAILAND 10260)
Dr
Kessararat UGSORNRAT
(Department of Industrial Physics and Medical Instrumentation, Faculty of Science, King Mongkut's University of Technology North Bangkok, THAILAND 10800)
