10th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors, Xi'an, China

Bonding Study towards Quality Assurance of the Belle-II Silicon Vertex Detector Modules

26 Sept 2015, 19:18

1m

Multi-function Hall (International Conference Center (Nanyang Hotel))

POSTER Strips After dinner POSTER session, with drinks: (All presenters are requested/encouraged to attend their posters; All participants are requested to participate the session, with drinks!)

Speaker

Mr Kookhyun Kang (on behalf of the Belle-II SVD Collaboration)

Description

The silicon vertex detector (SVD) for the Belle-II experiment comprises four layers of double-sided silicon strip detectors (DSSDs), assembled in a ladder-like structure. Each ladder module of the outermost SVD layer has four rectangular and one trapezoidal DSSDs supported by two carbon-fiber ribs. In order to achieve a good signal-to-noise ratio and minimize material budget, a novel chip-on-sensor "Origami" method has been employed for the three rectangular sensors sandwiched between the backward rectangular and forward (slanted) trapezoidal sensors. The poster describes the bonding procedures developed for making electrical connections between sensors and signal fan-out flex circuits (aka, pitch adapters), and pitch adapters and readout chips as well as the results in terms of the achieved bonding throughput and pull force.