Fondazione Bruno Kessler - FBK
Author in the following contributions
- Development of a new technology for the next generation of 3D Pixel Sensors for HL-LHC within the INFN (ATLAS-CMS) R&D program in collaboration with FBK.
- New developments in high-density SiPM technology at FBK
- Preliminary results from the first batch of Si 3D sensors fabricated at FBK on 6 inch wafers
- Design and TCAD simulation of a new generation of 3D Sensors for HL-LHC within the INFN (ATLAS-CMS) R&D program in collaboration with FBK
- Investigation of the Electrical Characteristics of Double-Sided 3D Sensors after Proton and Neutron Irradiation up to HL-LHC Fluencies
