Conveners
3D Sensors 1
- Cinzia Da Via (University of Manchester (GB))
Andrea Gaudiello
(Universita e INFN Genova (IT))
18/02/2015, 11:05
3D sensors has been developed for the Insertable B-Layer (IBL), an additional pixel layer that has been installed in ATLAS during the present shutdown of the LHC collider at CERN. It is presented in the talk the experience in designing, testing and qualifying sensors and detector modules that have been used to equip part of the IBL. Some very preliminary results will be presented from the...
Emanuele Cavallaro
(Universitat Autònoma de Barcelona (ES)),
Joern Lange
(IFAE Barcelona)
18/02/2015, 11:25
The ATLAS Forward Physics (AFP) project plans to install 3D silicon pixel detectors 210 m away from the interaction point and very close to the beamline at a radius of about 2-3 mm. This implies the need of slim edges in the order of 100 µm for the sensor side facing the beam to minimise the dead area. Another challenge is an expected non-uniform irradiation of the pixel sensors with high...
Fabio Ravera
(Universita e INFN Torino (IT))
18/02/2015, 11:45
For the CMS-TOTEM Precise Proton Spectrometer, tracking and timing detectors will be installed next year along the LHC beamline at ~$220$ m from the CMS interaction point. To measure protons scattered at very small angles, detectors will be placed within Roman Pots at a few mm from the LHC beam. Tracking detectors are supposed to receive an irradiation fluence up to $5x10^{15}$ p/cm$^2$. The...
DMS Sultan
(University of Trento and INFN)
18/02/2015, 12:05
This report addresses the experimental characterization of Double-Sided 3D radiation sensors, fabricated at FBK, irradiated with protons and neutrons up to fluencies in the order of 10$^{16}$ n$_{eq}$/cm$^2$ as the foreseen HL-LHC compliance. The study is mainly aimed at comparing different designs and technological solutions in terms of full depletion voltage and breakdown voltage in order to...
Maurizio Boscardin
(FBK Trento)
18/02/2015, 12:25
FBK has recently upgraded the pilot line from 4 inch to 6 inch wafers, a fact that brings both advantages and disadvantages for the fabrication of 3D sensors.
The talk will focus on the fabrication of the first internal batch of 3D sensors carried out on the new line in 2014. We report on: i) the main modifications introduced in the fabrication process with respect to the baseline process...
