23–25 May 2016
Bonn, LVR-LandesMuseum
Europe/Berlin timezone

Controlling thermal deformations

23 May 2016, 15:00
30m
Bonn, LVR-LandesMuseum

Bonn, LVR-LandesMuseum

Colmantstrasse 14-16, 53115 Bonn

Speaker

Freek Sanders (Nikhef National institute for subatomic physics (NL))

Description

For the LHCb silicon detector modules or VeloPix modules, thermal stability is an important issue. The sensors are being cooled down over a gradient of 50 degrees Celsius. Early prototype tests showed that the thermal deformation is in the sub millimeter range while the requirements only allow a few microns of movement. It is assumed that this issue is caused by different thermal expansions. To minimize this deformation a design is made that uses Borosilicate glass to match the coefficient of thermal expansion to that of Silicon and at the same time have a function as a thermal insulator. This prevents other materials from having a temperature gradient.

The presentation will go into detail in the following subjects; the material selection, the temperature depended properties, simulations and experiments.

Presentation materials