23 January 2017 to 3 February 2017
Campus of USP in Sao Paulo
Brazil/East timezone

Advanced 3D CMOS and interconnect technology and applications in Industry and Fundamental research

26 Jan 2017, 11:30
1h 30m
Abraão de Moraes Auditorium (IF) (Campus of USP in Sao Paulo)

Abraão de Moraes Auditorium (IF)

Campus of USP in Sao Paulo

Speaker

Dr Robert Patti (CEO Tezzaron Semiconductors, USA)

Description

Tezzaron Semiconductors is the world 3D-IC's leader and Dr Patti is instrumental in this lead. This lecture will concentrate on the 3D CMOS technology and new 3D interconnects and give some examples of applications and results including in Particle Physics. Dr. Patti will complement his lecture with an Hands on Lab introducing the attendants (even not electronics experts) to the specifics of the 3D-IC design.

Presentation materials