11th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors (HSTD11) in conjunction with 2nd Workshop on SOI Pixel Detectors (SOIPIX2017) at OIST, Okinawa, Japan

Development of pixel modules for the forward region of the ATLAS Tracker Upgrade

10 Dec 2017, 20:19

1m

Conference Center (Okinawa Institute of Science and Technology Graduate University (OIST))

POSTER Pixel sensors for tracking POSTER

Speaker

Craig Buttar (University of Glasgow (GB))

Description

The assembly and results from testing of pixel modules for the forward regions of the ATLAS Tracker Upgrade will be presented. Sensors have been developed for the ATLAS FE-I$ readout chip. Different bump-bonding methods have been investigated and the results of the bump-bonding yields determined from electrical measurements will be presented. The hybrid flex design and its assembly to the bump-bonded pixel module will be described. Results from the electrical tests of the assembled pixels before and after thermal cycling will be given. The interfaces to the electrical services will be discussed, particularly those to the 5Gbps links.

Contributing Author: Craig Buttar, University of Glasgow

Authors: R.L.Bates, P.J.Dervan, I.Tsurin, K.Arndt, D.Bortoletto, R.Plackett, W.Cunningham, K.Wraight, S.Naik, L.Flores, J.Pater, F.Munoz-Snachez, J.Stuart, S.Eisenhardt

Presentation materials

ATLAS_Upgrade_Pixels_final.pdf