9–13 Jul 2017
Monona Terrace Community and Convention Center
US/Central timezone

Status of Round Robin Test for Tensile Test on REBCO Wires at Cryogenic Temperature

10 Jul 2017, 14:00
2h
Exhibit Hall AB

Exhibit Hall AB

Speaker

Nadezda Bagrets (Karlsruhe Institute of Technology – KIT)

Description

Within the framework to establish standards of test methods for superconducting technical wires, various standards have been published by the International Electrotechnical Commission IEC (standard documents IEC 61788-1 to -20). Following the experience of the successful Round Robin Test RRT for Tensile Test on REBCO Wires at Room Temperature, the effort is extended to Tensile Test on REBCO Wires at Cryogenic Temperatures and is coordinated by CryoMaK lab in KIT. A round robin test is an inter-laboratory test (measurement, analysis, or experiment) performed independently several times in different laboratories. Identical samples are tested using identical or similar test procedure. Results analysis from different participants allows evaluation of the reproducibility of the test method and processes, and the proficiency of participating labs. Different commercially available five ReBCO wires from five different manufacturers and one BiSCCO wire from another supplier are purchased for testing. Materials are provided by VAMAS TWA 16. Samples are distributed between nine participating labs from five different countries. After the measurements are performed according to specified guidelines, the results will be evaluated statistically using F test to investigate the amount of scatter in the test results. The final goal of RRT is to issue an ISO/IEC Standard for cryogenic temperature tensile test for REBCO wires.
In this report the status and details of Round Robin Test on REBCO Wires at Cryogenic Temperatures are presented and discussed.

Author

Nadezda Bagrets (Karlsruhe Institute of Technology – KIT)

Co-authors

Arend Nijhuis (University of Twente) Mr Dustin McRae (FSU/NHMFL) Federica Pierro (Tufts University) Gen Nishijima (National Institute for Materials Science) Hyung-Seop Shin (Andong National University) Dr Klaus-Peter Weiss (KIT, Institute for Technical Physics) Prof. Kozo Osamura (Research Institute for Applied Sciences) Luisa Chiesa (Tufts University) Robert Walsh (Florida State University) Dr Yifei Zhang (SuperPower Inc.) Yoshinori Ono (National Institute for Materials Science) Dr Yue Zhao (China Shanghai Jiao Tong University)

Presentation materials