Feb 20 – 22, 2017
FBK, Trento
Europe/Zurich timezone

Thin planar pixel sensor productions at MPP for the ATLAS ITk

Feb 20, 2017, 3:00 PM
Aula Grande (FBK, Trento)

Aula Grande

FBK, Trento

Via Santa Croce, 77 38122 Trento ITALY


Anna Macchiolo (Max-Planck-Institut fur Physik (DE))


The ATLAS experiment will undergo around the year 2025 a replacement of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) with a new 5-layer pixel system.
Thin n-in-p planar pixel sensors are promising candidates to instrument the new pixel system, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. Different possible production processes for this kind of sensors will be presented. The performance of 100-150 μm thick sensors interconnected to FE-I4 chips will be compared up to a fluence of 10$^{16}$ 1 MeV n$_{eq}/cm^2$ in terms of charge collection and power dissipation.
The design of new sensor productions, compatible with the RD53A chip, with a 50x50 or 25x100 $\mu$m$^2$ pixel cell size will be shown together with possible techniques to improve the electrical isolation between sensor and chip. A first insight of the performance of pixels with these cell sizes is obtained with FE-I4 compatible sensors with a modified geometry.

TRACK Planar Sensors

Primary authors

Anna Macchiolo (Max-Planck-Institut fur Physik (DE)) Julien-Christopher Beyer (Max-Planck-Institut fur Physik (DE)) Richard Nisius (Max-Planck-Institut fur Physik (DE)) Alessandro La Rosa (Max-Planck-Institute for Physics (D)) Natascha Savic (Max-Planck-Institut fur Physik (DE))

Presentation materials