Conveners
Session 8: 3D Sensors (1)
- Gian-Franco Dalla Betta (INFN and University of Trento)
The talk will report on the INFN ATLAS-CMS joint research activity in collaboration with FBK, which is aiming at the development of new pixel detectors for the LHC Phase-2 upgrades. The talk will cover the main aspects of the research program, starting from the sensor design and fabrication technology, with an outlook on the future steps using both Silicon On Insulator (SOI) and Direct Wafer...
We report on the development of new 3D pixel sensors oriented to the Phase 2 Upgrades at the High-Luminosity LHC (HL-LHC), carried out within the framework of the INFN-FBK “Phase 2” R&D program.
These sensors have increased pixel granularity (e.g., 50×50 or 25×100 µm2 pixel size), thinner active layer (~100 µm) with columnar electrodes having narrower size (~ 5 µm) and reduced spacing (~ 30...
During the 2023-2024 shutdown, the Large Hadron Collider (LHC) will be upgraded to reach an instantaneous luminosity up to 7×10 cm-2 s-1. This upgrade of the accelerator is called High-Luminosity LHC (HL-LHC). The ATLAS and CMS detectors will be replaced to meet the challenges of HL-LHC: an average of 200 pile-up events in every bunch crossing and an integrated luminosity of 3000 fb-1 over...
Silicon pixels of area 25x100 and 50x50 square microns, fabricated at CNM using double sided 3D technology on 230 um thick wafers, are characterized using a Sr90 radioactive source and in a pion/proton test beam at the CERN SPS. Results are shown both for non-irradiated sensors and for sensors irradiated with protons at the CERN PS.
The ATLAS experiment will replace the entire inner tracking detector with a completely new silicon-only system. 3D silicon pixel sensors are promising candidates for the innermost layers of the Pixel detector due to their excellent radiation hardness and low power dissipation. 3D pixel sensors with 50x50 and 25x100 µm² pixel pitches have been produced at CNM Barcelona and studied by IFAE. The...
