May 20 – 25, 2018
US/Eastern timezone
Jouvence 131 De Jouvence road, Orford, QC,J1X 6R2, Canada

The 2018 Front-end Electronics workshop is the 11th of a series of very productive meeting where the best researchers of the world present the state of the art in the field. The meeting as a strong focus on full custom ASIC design instrumentation rather than system level and detectors themselves. Technical sessions are geared toward HEP experiments and their upgrades, astrophysics, particle physics, medical imaging, photon science and CMOS monolithic active pixel sensors. As microsystems have gotten denser, new packaging solution and interposer technologies are required and have a special interest. For instance, 3D vertical integration of heterogeneous processes have been a key to unprecedented microsystems and a session will be dedicated to this topic. Also, more experiments require cryogenic electronics, where the front-end is actually installed inside the noble liquid (Ar, Xe) and this opens the door to brand-new challenges such as interposer/ASIC electronic supports, having different thermal expansion coefficients. Talks on these themes will be welcome. The FEE 2018 is the perfect venue to discuss these topics.