20-25 May 2018
US/Eastern timezone


Invited Speaker

24 May 2018, 08:30


Invited Speaker: “Challenges and Research for High Density, Highly Integrated Microelectronic Packaging”

  • David Danovitch (University of Sherbrooke)

Invited Speaker: Quantum computing in silicon : Overview and opportunities in cryogenic front-end electronics

  • Michel Pioro Ladriere (University of Sherbrooke)

Presentation materials

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