TWEPP 2010 Topical Workshop on Electronics for Particle Physics

Session

PLENARY 4 - New interconnect technologies

22 Sept 2010, 14:15

Aachen, Germany

Conveners

PLENARY 4 - New interconnect technologies

• Jorgen Christiansen (CERN)

171. New interconnect technologies

Piet de Moor (IMEC)

22/09/2010, 14:15

Oral

Although CMOS technology has a proven track record in terms of performance, there are limitations of a single chip (and even more of a full system containing many chips) in terms of the traditionally lateral interconnects. The past years a lot of R&D was spent to develop 3D interconnect and integration technologies such as high density bump interconnects, through Si vias and advanced...