Speaker
Description
ALICE is planning to replace its innermost tracking layers during the LHC Long Shutdown 3 with a novel detector that will be as close as 18 mm to the interaction point and will have a target thickness of below 0.05 %X0 per layer. To achieve these figures, a wafer-scale Monolithic Active Pixel Sensor in 65 nm technology is being developed. The sensors, fabricated on 300 mm wafers, will reach dimensions of up to 280 mm × 94 mm. They will subsequently be thinned down to values between 20-40 μm, where they become flexible and are bent into truly cylindrical half-barrels.
This contribution will review the detector concept and will lay out the R&D path. Most importantly, first results from laboratory and beam tests with bent sensors will be presented.
