9–13 Jul 2023
Hawaii Convention Center
US/Hawaii timezone

M2Po2D-05: The Low-temperature Thermal Properties of Epoxy Resin Composites Enhanced by Graphene and Modified Alumina Hybrid Fillers

11 Jul 2023, 14:00
2h
Exhibit Hall III, Level 1

Exhibit Hall III, Level 1

Speaker

Yue Xiang

Description

In recent years, polymer/ceramic composites with high thermal conductivity have been widely used in microelectronic devices, superconducting magnets and aviation, and further improving their thermal conductivity is a great challenge. In this study, spherical alumina nanoparticles were modified with 3-aminopropyltriethoxy-silane (APTES) successfully. Furthermore, the modified alumian(M- Al2O3)/Epoxy and graphene/(M- Al2O3)/Epoxy composites were prepared and their properties were tested in the temperature range of 70 K-300 K. The results showed that the thermal conductivity of the composite with 1 wt% graphene and 60 wt% (M- Al2O3)/Epoxy is 13 times higher than that of pure epoxy at 70 K, which indicates its application prospect in thermal interface materials.

Keywords: thermal properties; polymer-matrix composites; low temperatures

Author

Yue Xiang

Co-authors

Mr Laifeng Li (Technical Institute of Physics and Chemistry) Mr Rongjin Huang (Technical Institute of Physics and Chemistry) Zhengrong Zhou (Technical Institute of Physics and Chemistry)

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