TWEPP 2011 Topical Workshop on Electronics for Particle Physics

Session

A5a - Packaging and Interconnects

A5a

Sep 29, 2011, 9:50 AM

Vienna, Austria

Conveners

A5a - Packaging and Interconnects

• Jorgen Christiansen (CERN)

145. Microfluidic cooling for detectors and electronics

Paolo Petagna (CERN)

9/29/11, 9:50 AM

Packaging

Oral

Micro-channel cooling is gaining considerable attention as an alternative technique for cooling of high energy physics detectors and front-end electronics. We are evaluating this technology for future tracking devices where material budget limitations are a major concern. Micro channel cooling is currently under investigation as an option for the cooling of the NA62 Gigatracker silicon pixel...

128. Progress on a Si-W ECAL Detection and Readout Interconnects

Mr Michael Woods (University of California Davis)

9/29/11, 10:15 AM

Packaging

Oral

The SiD collaboration is developing a Si-W sampling electromagnetic calorimeter, with anticipated application for the International Linear Collider. Assembling the modules for such a detector will involve bonding technologies for the interconnects, especially silicon detector wafer to a flex-cable readout bus attachments. We review the interconnect technologies involved, including oxidation...