8th International Meeting on Front-End Electronics

Interconnection technology and TSVs for ATLAS pixels in the ICV-SLID process

24 May 2011, 15:30

30m

Aula 3 (University of Bergamo)

3D/Vertical Integration and Advanced Interconnections

Speaker

Hans-Günther Moser (Max-Planck-Institut für Physik)

Presentation materials

Slides

Moser_FEE_2011.pdf

Moser_FEE_2011.ppt