8th International Meeting on Front-End Electronics

Session

3D/Vertical Integration and Advanced Interconnections

24 May 2011, 14:30

Aula 3 (University of Bergamo)

34. 3D CMOS submission

Mr Ray Yarema (FNAL)

24/05/2011, 14:30

35. CMC-CMP-MOSIS collaboration for a 3D-IC prototyping service

Kholdoun TORKI (CMP)

24/05/2011, 15:00

36. Interconnection technology and TSVs for ATLAS pixels in the ICV-SLID process

Hans-Günther Moser (Max-Planck-Institut für Physik)

24/05/2011, 15:30

37. 3D ASIC prototyping and plans with EMFT

Paul Seller (RAL)

24/05/2011, 16:30

38. Advanced CMOS-based pixel sensors

Piet De Moor (imec)

24/05/2011, 17:00

49. Analog front-ends for monolithic and hybrid pixels developed with a 3D CMOS process

Stefano Zucca (University of Pavia and INFN Pavia)

24/05/2011, 17:30

16. 2D MAPS in the Tezzaron/Chartered technology

Dr Daniele Passeri (University of Perugia (Italy))

24/05/2011, 18:00