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8th International Meeting on Front-End Electronics

May 24 – 27, 2011
University of Bergamo
Europe/Rome timezone

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Session

3D/Vertical Integration and Advanced Interconnections

May 24, 2011, 2:30 PM
Aula 3 (University of Bergamo)

Aula 3

University of Bergamo

Via Salvecchio 19 24129 Bergamo (BG) Italia

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  1. 34. 3D CMOS submission
    Mr Ray Yarema (FNAL)
    5/24/11, 2:30 PM
  2. 35. CMC-CMP-MOSIS collaboration for a 3D-IC prototyping service
    Kholdoun TORKI (CMP)
    5/24/11, 3:00 PM
  3. 36. Interconnection technology and TSVs for ATLAS pixels in the ICV-SLID process
    Hans-Günther Moser (Max-Planck-Institut für Physik)
    5/24/11, 3:30 PM
  4. 37. 3D ASIC prototyping and plans with EMFT
    Paul Seller (RAL)
    5/24/11, 4:30 PM
  5. 38. Advanced CMOS-based pixel sensors
    Piet De Moor (imec)
    5/24/11, 5:00 PM
  6. 49. Analog front-ends for monolithic and hybrid pixels developed with a 3D CMOS process
    Stefano Zucca (University of Pavia and INFN Pavia)
    5/24/11, 5:30 PM
  7. 16. 2D MAPS in the Tezzaron/Chartered technology
    Dr Daniele Passeri (University of Perugia (Italy))
    5/24/11, 6:00 PM
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