Speaker
Description
The characterization of detector support materials plays a crucial role in the design and construction of future colliders such as the electron-ion collider (EIC) and the Future Circular Collider (FCC), as it is imperative to achieve a very low material budget in order to minimize unwanted background signals and enhance the precision of the measurements made by the detector. The use of terahertz time domain spectroscopy (THz-TDS) in the non-destructive evaluation of material properties and detection of internal fractures and defects demonstrates its potential as a powerful tool for material characterization. We present a study validating the correlation between the optical properties of materials and their strain state using THz-TDS for the measurement of strain and stress states in complex multimaterial structural components, such as those found in the current detector support structures being used for the High-Luminosity Phase 2 CMS upgrade project. The study demonstrates the potential of terahertz time domain spectroscopy (THz-TDS) as a powerful tool for material characterization in the design and performance simulation of detector support structures, particularly in the mapping of strain at the interface between two polymeric materials. The data generated from this technique is useful in cohesive zone modelling to accurately predict the behavior of these materials in different mechanical and thermal loading conditions. Moreover, THz-TDS's ability to non-destructively detect internal fractures and defects is demonstrated in the development and testing of detector components, such as sensors, thermal interface materials, bonding adhesives, and epoxies. These materials must withstand high-energy particle collisions, and their behavior under these extreme conditions is crucial to the proper functioning of the detectors. THz-TDS provides a non-destructive, non-invasive, and accurate method for inspecting these visibly opaque cross-sections during long shut downs as a preventive maintenance technique.