Feb 17 – 21, 2025
Vienna University of Technology
Europe/Vienna timezone

On-chip digitization to improve the frame rate of the JUNGFRAU charge-integrating X-ray pixel detector

Feb 19, 2025, 10:40 AM
50m
Vienna University of Technology

Vienna University of Technology

Gusshausstraße 27-29, 1040 Wien
Board: 14
Poster Electronics Coffee & Posters B

Speaker

Patrick Sieberer (Paul Scherrer Institut PSI)

Description

JUNGFRAU is a state-of-the-art charge-integrating X-ray detector used mainly for imaging, diffraction and spectroscopy experiments at synchrotrons and free-electron lasers. The current frame rate is 2.2 kHz, limited by analogue signal integrity due to the number of available output pads. With the goal to increase the frame rate of the detector to over 10 kHz, we have designed a digital 3.125 Gbps high-speed serial readout. Thus, the development of a fast Analog-To-Digital Converter ADC has become our primary objective to overcome the aforementioned constraints. In addition, on-chip digitization reduces noise pickup and distortion caused by wirebonds and other off-chip components.
This contribution focuses on design and characterization of the new ADC prototype including measurements and simulations. Standard ADC characterization techniques, including static and dynamic histogram testing are presented together with a full system test using one of our analogue readout chips and sensors assemblies, in combination with an X-ray source.
The ADC has been submitted in June 2024 and is expected to arrive in October 2024. Its characterization campaign will begin immediately after reception.

Author

Patrick Sieberer (Paul Scherrer Institut PSI)

Co-authors

Aldo Mozzanica Anna Bergamaschi Bernd Schmitt Dr Davide Mezza (Paul Scherrer Institut) Dr Julian Heymes (Paul Scherrer Institut) Kirsty Paton (Paul Scherrer Institut) Konstantinos Moustakas Maria del Mar Carulla Areste Roberto Dinapoli (Paul Scherrer Institut) Dr Viktoria Hinger (Paul Scherrer Institut) Dr Xiangyu Xie (Paul Scherrer Institut)

Presentation materials