Speaker
Description
High-granularity pixel readouts such as the Timepix4 ASIC are increasingly important in gaseous detectors, as they enable precise spatial and temporal measurements, allowing fine pattern reconstruction and detailed studies of charge transport properties. Micro-Pattern Gaseous Detectors (MPGDs) provide the matching excellent spatial resolution, along with flexible gas amplification structures, enabling 4D particle tracking and the study of the topology of ionization tracks when used together. In this work, we present the progress achieved in the hybridization of these two technologies by the GDD team at CERN.
The integration of the Timepix4 ASIC with MPGDs poses challenges in material minimization and signal coupling. Within this scope, a first prototype has been completed, in which a Timepix4 chip was embedded between two polyimide foils for subsequent coupling to an MPGD. While the mechanical integrity of the assembly showed promising results, the validation of the electrical connection to the chip using a flexible PCB readout foil was not successful. This has led to design modifications for the next generation of prototypes, which are currently under production.
In parallel, a second line of work focuses on the mechanical coupling (through tension) between the ASIC and MPGDs, in particular the $\mu$RWell. In this approach, we aim to replicate the main advantage of the embedding process -- namely, the intrinsic discharge protection provided by the polyimide -- while achieving comparable signal coupling between the chip and the amplification structure. Initial tests showed good coupling between the $\mu$RWell and the Timepix4, reflected in the relatively uniform gain and energy resolution across different regions of the detector. The high operational stability of the system also allowed for extended data-taking periods.
Upcoming studies include test-beam campaigns to better characterize the system in terms of timing and tracking capabilities. Additional versions of the system, comprising a DLC anode coupled to a triple GEM or a MicroMegas, are also planned in the coming weeks to further explore the system's capabilities. The drift region will also be increased to allow for longer particle paths and, by exploiting the high granularity of the ASIC, study the topology of charge clusters in greater detail. In the longer term, developments will explore the tiling of multiple Timepix4 chips side by side to increase the readout area. This has been enabled by the introduction of Through Silicon Vias in the most recent generation of Timepix, which eliminate the need for wire bonds and thereby minimize dead regions.
In this presentation, we review the integration of a $\mu$RWell with Timepix4. We begin by outlining the status, challenges, and achievements of the novel approach based on fully embedding the ASIC within polyimide foils, and then present the tests performed and results obtained with the mechanically coupled configuration.
| Name of the speaker | Eliška Jelínková |
|---|---|
| Eligible for the Georges Charpak Young Scientist Award. | yes |