TWEPP 2025 Topical Workshop on Electronics for Particle Physics

Session

Production

6 Oct 2025, 15:00

Rethymno, Crete, Greece

Conveners

Production

• Francois Vasey (CERN)
• Magnus Hansen (CERN)

Production

• Magnus Hansen (CERN)
• Francois Vasey (CERN)

46. Factory Acceptance Test for the CMS Phase-2 back-end card Serenity-S1

Hendrik Alexander Krause (KIT - Karlsruhe Institute of Technology (DE))

06/10/2025, 15:00

Production, Testing and Reliability

Oral

As part of the CMS phase-2 upgrade, the Serenity collaboration is developing Serenity-S1, a versatile FPGA-based processing card using the ATCA form factor. Widely adopted by various subdetector systems for the back-end data processing, a total of 777 boards are planned for production. This contribution presents the Factory Acceptance Test (FAT) designed for automated and efficient board...

111. Large-scale tests for the characterisation of the lpGBT stuck at power-up issue

Daniel Hernandez Montesinos (CERN)

06/10/2025, 15:20

Production, Testing and Reliability

Oral

The Low-power Gigabit Transceiver (lpGBT) is a radiation-tolerant ASIC used in high-energy physics experiments for multipurpose high-speed bidirectional serial links. In 2023, almost 200,000 lpGBTs V1 were tested with a production test system that exercises the entire ASIC functionality to ensure its correct operation. Furthermore, qualification tests (Total Ionizing Dose, Single-Event...

165. On-wafer 10 Gb/s signal testing of large-area monolithic active pixel sensors for the ALICE ITS3 and ePIC SVT detectors

Stefano Caregari (Massachusetts Inst. of Technology (US))

06/10/2025, 15:40

Production, Testing and Reliability

Oral

We present a novel 10 Gbps wafer-level testing system to characterize stitched Monolithic Active Pixel Sensors (MAPS) for ALICE ITS3 and ePIC SVT. Using a custom probe card and a 12-inch wafer-probe station, we demonstrate, for the first time in high-energy physics, 10 Gbps link characterization directly on wafer. Signal integrity was validated via bit error rate testing (BER < 10⁻¹²) and <70...

8. A big step towards ATLAS ITk: Performance Characterization of the very first Loaded Local Support Structures

Anna Swoboda (University of Innsbruck (AT))

06/10/2025, 16:30

Production, Testing and Reliability

Oral

In order to fulfill the demands of the High-Lumi LHC, the whole ATLAS experiment will undergo a major upgrade.
The current Inner Detector will be replaced by it‘s all-silicon successor - the Inner Tracker (ITk).
The smallest feature complete detector units of the ITk are so-called Loaded Local Supports (LLS).
These LLS have now been tested for the first time, in a complex test-setup, which...

201. Investigating the Operational Margin of ATLAS ITk Pixel Module Serial Powering

Deion Elgin Fellers (Lawrence Berkeley National Lab. (US))

06/10/2025, 16:50

Production, Testing and Reliability

Oral

ATLAS ITk Pixel detector modules are operated in serial power mode using a Shunt-LDO circuit inside the ITkPix readout chip. Due to cooling requirements, the system must be operated within stringent power constraints, resulting in only 10% of the current being burned in the shunt during nominal physics operation. Since the current consumption scales with hit activity and there are significant...

196. Reduction of constraints in the specification for the Hybrid circuit procurement for the CMS Phase-2 Upgrade

Mark Istvan Kovacs (CERN)

06/10/2025, 17:10

Production, Testing and Reliability

Oral

Abstract
New sensor modules are currently being produced for the Tracker in the CMS Phase-2 Upgrade. These Strip-Strip and Pixel-Strip modules are the two main building blocks of the Outer Tracker. All together 8000 Strip-Strip and 5880 Pixel-Strip modules will be constructed and their construction requires the mass production of 47520 hybrid circuits. Despite careful preparation of the...