Speakers
Marvin Johnson
(Fermi National Accelerator Lab.)Dr
Ronald Lipton
(Fermi National Accelerator Lab. (US))
Description
Future intelligent tracking systems are likely to require large area sensor modules with
finely segmented, intelligent readout. However conventional module construction, with
readout bonded at the periphery and significant sensor dead area, makes it difficult
to build large area pixelated modules with good yield,low mass and small dead area. The
combination of 3D active edge sensors and 3D (vertically integrated) electronics solves these
problems by enabling the fabrication of readout chip/sensor tiles which can be butted on four
sides and are readout through the top surface. We describe the concept for these "large area
array" tiles and the design of active edge sensors and test modules currently being fabricated.
We describe applications for the CMS Track Trigger as well as vertex detectors for
future lepton colliders.
Author
Dr
Ronald Lipton
(Fermi National Accelerator Lab. (US))
