JCC Clemens
(Universite d'Aix - Marseille II (FR))
04/05/2012, 08:30
Even if 3D electronics suffers difficult beginnings, industrial trends are now strongly pushing that way to a production phase. Keeping in mind the usual arguments of power consumption, speed, technology mixing, new and less expected possibilities are now appearing.
In trackers world, few attempts have been made to introduce 3D not only as an alternative to shrinking technologies but also as...
Marvin Johnson
(Fermi National Accelerator Lab.), Dr
Ronald Lipton
(Fermi National Accelerator Lab. (US))
04/05/2012, 09:00
Development of critical technologies and system integration
Future intelligent tracking systems are likely to require large area sensor modules with
finely segmented, intelligent readout. However conventional module construction, with
readout bonded at the periphery and significant sensor dead area, makes it difficult
to build large area pixelated modules with good yield,low mass and small dead area. The
combination of 3D active edge sensors and...
Lars Eklund
(University of Glasgow (GB))
04/05/2012, 09:30
Development of critical technologies and system integration
Multi-chip Modules - Deposited (MCM-D) technology can be applied to
silicon strip modules and promises advantages in terms of integration
complexity and material budget. The principle is to deposit
alternating dielectric and metal layers directly on the silicon
sensor, building up a PCB like structure. With lithographic techniques
traces and vias are etched with high resolution creating a...
Georges Blanchot
(CERN)
04/05/2012, 10:00
Development of critical technologies and system integration
The upgrade of the CMS tracker at the HL-LHC will require the design of new front-end modules. These tracker modules will embed new front-end flip-chip ASICs that will be bump bonded to high density substrates, and those will be directly wire bonded to the tracker sensors. The resulting hybrid circuits will concentrate the module data flow and feed an optical transmitter module (GBT) that will...
