Conveners
Plenary 7: Vertically Integrated Circuits
- Ken Wyllie (CERN)
Yann Lamy
(CEA- LETI)
27/09/2013, 09:00
Oral
After a tremendous technology modules development phase, 3D integration is now looking for the right use cases. Miniaturization and bandwidth needs are partially addressed by 2,5D heterogeneous interposers, but with limited impacts on competitiveness and cost. Disruptive 3DIC stacking is potentially offering unmatched performances and scalability in both niche and consumers markets but is...
