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TWEPP 2013 - Topical Workshop on Electronics for Particle Physics

23–27 Sept 2013
Perugia, IT
Europe/Zurich timezone

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Session

Plenary 7

27 Sept 2013, 09:00
Perugia, IT

Perugia, IT

<font face="Verdana" size="2.5">Congress center Giò Via R. D'Andreotto, 19 06124 Perugia (PG) Italy

Conveners

Plenary 7: Vertically Integrated Circuits

  • Ken Wyllie (CERN)

Presentation materials

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  1. 226. 3D Integration, from tool box to applications
    Yann Lamy (CEA- LETI)
    27/09/2013, 09:00
    Oral
    After a tremendous technology modules development phase, 3D integration is now looking for the right use cases. Miniaturization and bandwidth needs are partially addressed by 2,5D heterogeneous interposers, but with limited impacts on competitiveness and cost. Disruptive 3DIC stacking is potentially offering unmatched performances and scalability in both niche and consumers markets but is...
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