TWEPP 2013 - Topical Workshop on Electronics for Particle Physics

Session

Radiation Tolerant Components and Systems

Sep 25, 2013, 11:10 AM

Perugia, IT

Conveners

Radiation Tolerant Components and Systems: A3b

• Jorgen Christiansen (CERN)

39. Irradiation Tests and Expected Performance of Readout Electronics of the ATLAS Hadronic Endcap Calorimeter for the HL-LHC

Faig Ahmadov (JINR)

9/25/13, 11:10 AM

Oral

The readout electronics of the ATLAS Hadronic Endcap Calorimeter (HEC) will have to withstand an about 10 times larger radiation environment at the future high-luminosity LHC (HL-LHC) compared to the LHC design values. The radiation damages of the front-end electronics made in GaAs technology could significantly affect the HEC performance. Recent measurements of neutron and proton irradiation...

98. Characterization of COTS ADC radiation properties for ATLAS LAr calorimeter readout upgrade

Helio Takai (Brookhaven National Laboratory (US))

9/25/13, 11:35 AM

Oral

The ATLAS LAr calorimeters plan to upgrade the readout electronics for both Phase-I and Phase-II LHC luminosity upgrades. Detector signals will be digitized at the front-end, and data will be streamed out to the back-end system continuously. Therefore, radiation tolerant ADCs are key components for both upgrade phases. This presentation will report on irradiation test results of...

205. Performance of capacitively coupled active pixel sensors in 180 nm HV CMOS technology after irradiation to HL-LHC fluences

Simon Feigl (CERN)

9/25/13, 12:00 PM

Oral

We explore the concept of using a deep-submicron HV CMOS process to produce a drop-in replacement for traditional radiation-hard silicon sensors. Such active sensors contain simple circuits, e.g. amplifiers and discriminators, but still require a traditional (pixel or strip) readout chip. This approach yields most advantages of MAPS (improved resolution, reduced cost and material budget,...