Speaker
Tilman Rohe
(Nuclear and Particle Physics Department)
Description
The hybrid pixel detectors used in the LHC experiments use a vertical interconnection technique, the so-called bump bonding. As the pitch below 100 µm, required in these applications, cannot be fullfilled with standard industrial processes (e.g. the IBM C4 process), an in-house bump bond process with reflowed indium bumps was developed at PSI as part of the R&D for the CMS-pixel detector. Its reliability of this process was demonstrated in the successful construction of the PILATUS 6M (about 60 modules) and the barrel part of the CMS pixel detector (about 800 modules).
The talk describes the process and discusses it advantages and limitations.
Author
Tilman Rohe
(Nuclear and Particle Physics Department)
