3rd Workshop on Advanced Silicon Radiation Detectors (3D and P-type Technologies)

3D interconnection for pixel detectors

16 Apr 2008, 12:30

30m

Residencia CSIC-Generalitat de Catalunya, Barcelona, Spain

Report on new techniques for interconnectivty (3D-connectivity) Pixels

Speaker

Hans-Günther Moser (Max-Planck-Institut)

Description

3D interconnection technologiy opens new possibilties for advanced pixel detectors. These include material reduction, lower pitch, more functionality per pixel, 4-side buttable layouts and multi-layer ASICs with optimized technologies. An overview on the technology and current or planned projects will be given.

Presentation materials

Slides

Barcelona_HG_Moser_3D_integration.pdf

Barcelona_HG_Moser_3D_integration.ppt